Clean Pack is a high‑clean flexible packaging solution designed to protect sensitive semiconductor and optics materials from contaminants during handling, storage, and transportation. Manufactured in a controlled Class 1,000 clean room, Clean Pack helps maintain cleanliness conditions which is crucial for wafers, photomasks, and precision optical components.
Product Features
Class 1,000 Clean Room Production
By producing in a Class 1,000 clean room and using non-contact foreign substance removers, we minimize the amount of particles.
Barrier & Non-Barrier Configurations
Clean Pack is offered in barrier and non-barrier constructions, allowing customization for moisture, oxygen, or chemical-sensitivity needs.
Gusseted and Non-Gusseted Formats
Clean Pack is available in both gusseted and non-gusseted formats, offering improved stability, space efficiency, and ease of handling depending on application requirements.
Low MOQ: From 1 Box
We offer a range of standard sizes for immediate purchase, including options available from as little as one box, and can provide customized sizes as needed.
Applications
- FOUP and FOSB Carrier
- Wafers and Compound Wafers
- Photomasks
- Electronic Materials and Parts
- Optical Components
ZACROS has long supported the semiconductor industry by supplying Clean Pack solutions used for wafers, photomasks, electronic materials, and other contamination‑sensitive components, demonstrating a strong and proven track record in high‑clean packaging performance.
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